MS4602 FUNDAMENTAL OF SEMICONDUCTOR DEVICES

This course aims to provide students with a foundational knowledge of semiconductor devices, preparing them for specialization in semiconductor materials and devices. It focuses on the principles of operation behind modern semiconductor devices, including p-n junction diodes, light-emitting diodes (LEDs), MOS transistors, bipolar transistors, Laser, photodetectors, solar cells, and photonic devices. By leveraging knowledge from prior courses such as MS2018: electronic and Magnetic Properties of Materials and MS3012: Micro/Nanoelectronics Processing, this subject serves as a critical stepping stone for advanced studies on semiconductor devices. The knowledge gained through this subject will be useful in understanding other subjects, such as Fundamentals of Integrated Circuit (IC) Processing, LCD display, Photonic materials and devices, Failure Analysis and Reliability Studies of Microelectronics. The course will feature two technical lectures. The first one will include a video on wafer processing, along with a briefing on cleanroom safety rules and protocols. Students will have the opportunity to see various wafer processing equipment used across different process modules. By the end of this lecture, students should have a solid understanding of cleanroom safety and operational protocols related to wafer processing. The second lecture will introduce the characterization facility, focusing on the atomic-scale study of semiconductor materials. This session will cover the structure, properties, behaviour, and processing of these materials, emphasizing their applications in engineering. Atomic-level crystallographic, structural, and chemical analyses using electron and X-ray probes are critical for optimizing materials and discovering new ones. These analyses provide essential insights for the design, development, and validation of semiconductor devices.

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