1. To study deep sub-micron front end process technology 2. To study deep sub-micron back end process technology 3. To study characterization techniques relevant to deep sub-micron process technology 4. To study advanced wafer level packaging technology
| Academic Units | 3 |
| Exam Schedule | Not Applicable |
| Grade Type | Letter Graded |
| Department Maintaining | EEE |
| Prerequisites | Year 4 standing 1. To study deep sub-micron front end process technology 2. To study deep sub-micron back end process technology 3. To study characterization techniques relevant to deep sub-micron process technology 4. To study advanced wafer level packaging technology |
| Index | Type | Group | Day | Time | Venue | Remark |
|---|
0930
1030
1130
1230
1330
1430
1530
1630
1730
We would encourage you to review with the following template.
AY Taken: ...
Assessment (Optional): ...
Topics (Optional): ...
Lecturer (Optional): ...
TA (Optional): ...
Review: ...
Final Grade (Optional): ...