1. To study deep sub-micron front end process technology 2. To study deep sub-micron back end process technology 3. To study characterization techniques relevant to deep sub-micron process technology 4. To study advanced wafer level packaging technology
| Academic Units | 3 |
| Exam Schedule | Not Applicable |
| Grade Type | Letter Graded |
| Department Maintaining | EEE |
| Prerequisites | Year 4 standing 1. To study deep sub-micron front end process technology 2. To study deep sub-micron back end process technology 3. To study characterization techniques relevant to deep sub-micron process technology 4. To study advanced wafer level packaging technology |
| Index | Type | Group | Day | Time | Venue | Remark |
|---|---|---|---|---|---|---|
| 32575 | LEC/STUDIO | A | MON | 1830-2120 |
0930
1030
1130
1230
1330
1430
1530
1630
1730
EE6601
LEC/STUDIO |
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