The course will provide you with the basic concepts of the engineering principles behind semiconductor processing, wafer fabrication and physical principles underlying the operation of basic semiconductor devices. The contents of the course include the fundamentals of p-n diodes, bipolar devices, MOS devices, deposition techniques, diffusion and thermal oxidation, ion implantation, lithography and etching. Contents: Fundamentals of Bipolar Devices. MOS Devices. Crystal growth and wafer preparation. Deposition Techniques. Diffusion and thermal oxidation. Ion implantation. Lithography. Etching.
| Academic Units | 3 |
| Exam Schedule | Fri May 08 2026 00:00:00 GMT+0000 (Coordinated Universal Time) 09:00-11:00 |
| Grade Type | Letter Graded |
| Department Maintaining | EEE |
| Prerequisites | |
| Not Available as BDE/UE to Programme | MAT |
| Index | Type | Group | Day | Time | Venue | Remark |
|---|---|---|---|---|---|---|
| - | LEC/STUDIO | EELE | TUE | 1330-1520 | LT29 |
0930
1030
1130
1230
1330
1430
1530
1630
1730
EE3013
32606
TUT | TR+78
EE3013
32608
TUT | TR+78
EE3013
LEC/STUDIO | LT29
EE3013
32607
TUT | TR+77
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